Tecasint 5051

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  1. Tecasint 5051 W
  2. Tecasint 5051 North
Tecasint

Wicks easily into tight spaces

5051 is an optically clear, low viscosity, electrically isolating epoxy compound. It bonds well to most substrates such as metals, glass, ceramics, and most plastics. The material is free flowing, making it ideal for potting and underfill applications.

Work Life @ 25°C8 hours
Mixed Viscosity @ 25°C320 cPs
Pot Life @ 25°C4 hours
Shelf Life12 months @ 25°C (2‐part Kits)12 months @ ‐40°C (Cryo‐Pac®)
Mix Ratio100A : 34.5B Parts By Weight
Tecasint 5051

I tecasint (pi) Depending upon the type, provide high strength with a low level of creep and good wear-resistance up to 300 °C in continuous use. Dimensional stability, electrical insulation, high purity, low outgas- sing. TECASINT 4121 black – Polyimide 4000 series 15% graphite filler TECASINT 5051 grey-green– Polyimide 5000 series 30% glass fibre TECASINT 8001 yellow-brown – Polyimide 8000 series 80% PTFE 20% polymide. Ensinger TECASINT 5051 Polyimide, 30% Glass Fiber Filled (PI) Categories: Polymer; Thermoplastic; Polyimide, Thermoplastic; Thermoplastic Polyimide, Glass Fiber. Material Notes: TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excellent wear.

Cure Options

6 hours @ 80°C8 hours @ 65°C8 days @ 25°C

ColorClear
Shore D Hardness83
Glass Transition Temp (°C)85
Lap Shear 2024T3 Clad (psi)3,300
Density (g/cc)1.15
Refractive Index1.56
Shrinkage Linear (%)0.2

Electrical Properties

Based on cure of 6 hours @ 80°C

Dielectric Constant3.013 @ 60 Hz3.052 @ 1k Hz2.846 @ 100k Hz
Dissipation Factor0.0061 @ 60 Hz0.0118 @ 1k Hz0.0382 @ 100k Hz
Volume Resistivity (ohm‐cm)1.7E 16 @ 500 VDC
Glass Transition Temp (°C)85
Degradation Temp. (°C)250
Tecasint 5051

Outgassing Properties

Based on cure of 6 hours @ 80°C

TML (%)0.58
CVCM (%)0.01
WVR (%)0.26

Acoustic Properties

Based on cure of 6 hours @ 80°C

Velocity (m/s)2,645
Impedance (MRayles)3.05
Loss (dB/cm-MHz)-6.2
Density (g/cc)1.15

Key Features

  • Bonds Well to Most Substrates
  • Free Flowing
  • Low Outgassing
  • Wicks Easily Into Tight Spaces
  • Long Work Life
  • Low Viscosity
  • Optically Clear
  • User‐friendly Packaging

The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.

Tecasint 5051 e

Tecasint 5051 W

2/3/2017

Tecasint 5051 North

How to get started

Tecasint 5051 s.

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